Clean Soldering Techniques
- Document #:
- LIGO-T1300040-v1
- Document type:
- T - Technical notes
Other Versions:
- Abstract:
- A short note to capture concepts and methods for achieving reliable and relatively clean solder joints for ultra-high vacuum applications. This process is likely to evolve over time, but is initially targeted at soldering items that are not practical to be re-cleaned via the standard LIGO clean and bake process. An example of when this soldering procedure might be used would be a spot repair of a wire or solder joint for an item that is part of a complex system rendering it impractical to disassemble.
- Files in Document:
-
- PDF Version (CleanSoldering-v1.pdf, 80.5 kB)
- Other Files:
- Word Version (CleanSoldering-v1.docx, 21.6 kB)
- Topics:
- Authors:
- Keywords:
- soldering
- Notes and Changes:
- Here's a set of data to aid in buying the right solder:
Digi-Key Part Number
KE1110-ND
Manufacturer
Kester Solder
Manufacturer Product Number
24-6337-0007
Description
SOLDER RA FLUX 27AWG 63/37 1LB
Detailed Description
Leaded Rosin Activated (RA) Wire Solder Sn63Pb37 (63/37) 27 AWG, 28 SWG Spool, 1 lb (454 g)
- Referenced by:
- LIGO-E1700333-v1: Optical Contamination Cavity Test Results: Kester 6337 (Sn63Pb37) Solder
- LIGO-E1700332-v1: Material Qualification RGA Test Results: Kester 6337 (Sn63Pb37) Solder