Waiver for vacuum bake and RGA scan of a bonded repair of a beam dump on the L1 OMC Breadboard Assy, ASSY-D1201439-3

Document #:

LIGO-E1600180-v1

Document type:

E - Engineering documents

Abstract:

Waiver for vacuum bake and RGA scan of a bonded repair of a beam dump on the L1 OMC Breadboard Assy, ASSY-D1201439-3

Files in Document:

• E1600180-v1 waiver for bonded repair of beam dump on L...pdf (215.5 kB)

Topics:

• System Engineering
• Vacuum

Authors:

• Dennis Coyne

Related Documents:

• LIGO-E1400330: Waiver for another RGA scan of the OMC Breadboard Assy, ASSY-D1201439-3

Referenced by:

• LIGO-E1500147-v1: aLIGO, Waiver Log